Your notebook or small-form-factor machine can now experience the latest, cutting-edge memory technology with Kingston FURY™ Impact DDR5. With Intel® XMP 3.0 Certified SODIMM kit capacities of up to 64GB, Kingston FURY Impact DDR5 packs all the enhanced features of DDR5 into a slim, compact form factor. On Plug N Play* enabled modules, Kingston FURY Impact DDR5 automatically overclocks, giving your system a boost in performance without having to enable a profile. Modules featuring XMP 3.0 profiles can overclock to the highest frequency published, up to 6400MT/s, by selecting the profile in BIOS settings.

Mighty DDR5 SODIMM performance
With a starting speed of 4800MT/s, DDR5 is 50% faster than DDR4 for a boost in gaming, rendering, and multitasking.

Plug N Play automatic overclocking functionality*
Kingston FURY Impact DDR5’s PnP modules automatically overclock to the highest listed speed.

Intel® XMP 3.0 Certified
Maximise memory performance with advanced pre-optimised timings, speed and voltage for overclocking.

Low Power Consumption, Increased efficiency
Keep your system cool and efficient with Kingston FURY Impact DDR5’s low power draw.

Improved stability with on-die ECC
Maintain data integrity while hitting overclocking speeds.

Kingston Technology FURY Impact. Component for: Laptop, Internal memory: 16 GB, Memory layout (modules x size): 1 x 16 GB, Internal memory type: DDR5, Memory form factor: 262-pin SO-DIMM, CAS latency: 40

Internal memory	16 GB
Memory layout (modules x size)	1 x 16 GB
Internal memory type	DDR5
Component for	Laptop
Memory form factor	262-pin SO-DIMM
ECC	No
Buffered memory type	Unregistered (unbuffered)
On-Die ECC	Yes
CAS latency	40
Memory data transfer rate	4800 MT/s
Memory ranking	1
Memory voltage	1.1 V
Module configuration	2048M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	29.12 ns
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
SPD profile	Yes
Programming power voltage (VPP)	1.8 V
Country of origin	China, Taiwan
Cooling type	Heatsink
Lead plating	Gold
JEDEC standard	Yes
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Width	0.15" (3.8 mm)
Depth	2.74" (69.6 mm)
Height	1.18" (30 mm)
Weight	0.296 oz (8.4 g)
Package width	2.25" (57.1 mm)
Package depth	0.55" (14 mm)
Package height	6.75" (171.4 mm)
Package weight	0.943 oz (26.7 g)
Master (outer) case width	7.75" (196.8 mm)
Master (outer) case length	12.2" (311.1 mm)
Master (outer) case height	2.4" (61 mm)
Master (outer) case weight	28.6 oz (812.1 g)
Quantity per master (outer) case	25 pc(s)