8GB, 16GB and 32GB capacities up to 3200MT/s
Get your notebook or small-form-factor machine fully equipped with Kingston FURY™ Impact DDR4 SODIMM and minimise system lag. Ready for AMD Ryzen™, Intel® XMP-ready and XMP Certified in kit capacities of up to 64GB, FURY Impact DDR4 features Kingston’s innovative Plug N Play* overclocking technology, which automatically engages the factory preset speed and latency timings without having to change any settings in the BIOS. Designed to run cool, quiet and efficiently at only 1.2V, these sleek black modules provide a hassle-free boost to your system’s performance

Powerful SODIMM performance
Maximise your memory and get a boost to your gaming, multitasking and rendering.

Plug N Play automatic overclocking functionality*
Impact DDR4 automatically overclocks itself to the highest published frequency.

Intel® XMP-ready and XMP Certified
Designed to maximise the performance of our memory modules, our engineers have predefined Intel Extreme Memory Profiles to reach speeds of up to 3200MT/s.

Ready for AMD Ryzen™
Get memory that’s Ready for AMD Ryzen and will seamlessly integrate with your AMD-based SODIMM-compatible system. A reliable, compatible performance boost for your build.

Higher performance with low power consumption
Run your system cool and efficiently with Impact DDR4’s low 1.2V power draw.

Slim form factor, sleek design
The black PCB and sleek thermal label deliver big style with a small footprint.

Kingston Technology FURY Impact. Component for: Laptop, Internal memory: 16 GB, Memory layout (modules x size): 2 x 8 GB, Internal memory type: DDR4, Memory clock speed: 1600 MHz, Memory form factor: 260-pin SO-DIMM, CAS latency: 20

Internal memory	16 GB
Memory layout (modules x size)	2 x 8 GB
Internal memory type	DDR4
Memory clock speed	1600 MHz
Component for	Laptop
Memory form factor	260-pin SO-DIMM
ECC	No
Buffered memory type	Unregistered (unbuffered)
CAS latency	20
Memory data transfer rate	3200 MT/s
Memory ranking	1
Memory voltage	1.2 V
Module configuration	1024M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	26.25 ns
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Programming power voltage (VPP)	2.5 V
Country of origin	China, Taiwan
Cooling type	Heatsink
Backlight	No
JEDEC standard	Yes
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Width	0.15" (3.8 mm)
Depth	2.74" (69.6 mm)
Height	1.18" (30 mm)
Weight	0.586 oz (16.6 g)
Package width	3.75" (95.2 mm)
Package depth	0.55" (14 mm)
Package height	6.75" (171.4 mm)
Package weight	1.61 oz (45.6 g)
Master (outer) case width	8" (203.2 mm)
Master (outer) case length	12.2" (311.1 mm)
Master (outer) case height	4" (101.6 mm)
Harmonized System (HS) code	84733020
Master (outer) case weight	2.98 lbs (1.35 kg)
Quantity per master (outer) case	25 pc(s)