Get your notebook or small-form-factor machine fully equipped with Kingston FURY™ Impact DDR4 SODIMM and minimise system lag. Ready for AMD Ryzen and Intel XMP-ready in capacities of up to 64GB, Plug N Play FURY Impact DDR4 automatically overclocks to the highest frequency published, up to 3200MT/s*, to support Intel and AMD’s latest CPU technologies. Slot in the sleek black PCB for a hassle-free boost, no need to tinker with the BIOS. Upgrade your system’s performance and still run coolly, quietly and efficiently, thanks to FURY Impact DDR4’s low 1.2 voltage.

Powerful SODIMM performance
Maximise your memory and get a boost to your gaming, multitasking and rendering.

Plug N Play automatic overclocking functionality*
Impact DDR4 automatically overclocks itself to the highest published frequency.

Intel XMP-ready profiles
Our engineers have predefined Intel Extreme Memory Profiles designed to maximise the performance of our memory modules, reaching speeds of up to 3200MT/s.

Ready for AMD Ryzen
Get memory that’s ready for AMD Ryzen and will seamlessly integrate with your AMD-based SODIMM-compatible system. A reliable, compatible performance boost for your build.

Higher performance with low power consumption
Run your system cool and efficiently with Impact DDR4’s low 1.2V power draw.

Slim form, sleek design
The black PCB and sleek thermal label deliver big style with a small footprint.

Kingston Technology FURY Impact. Component for: Laptop, Internal memory: 16 GB, Memory layout (modules x size): 1 x 16 GB, Internal memory type: DDR4, Memory clock speed: 1600 MHz, CAS latency: 20

Internal memory	16 GB
Memory layout (modules x size)	1 x 16 GB
Internal memory type	DDR4
Memory clock speed	1600 MHz
Component for	Laptop
ECC	No
Buffered memory type	Unregistered (unbuffered)
CAS latency	20
Memory data transfer rate	3200 MT/s
Memory ranking	1
Memory voltage	1.2 V
Module configuration	2048M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	26.25 ns
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Programming power voltage (VPP)	2.5 V
Country of origin	China, Taiwan
Cooling type	Heatsink
Backlight	No
JEDEC standard	Yes
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Width	0.15" (3.8 mm)
Depth	2.74" (69.6 mm)
Height	1.18" (30 mm)
Weight	0.293 oz (8.3 g)
Package width	2.25" (57.1 mm)
Package depth	0.55" (14 mm)
Package height	6.75" (171.4 mm)
Package weight	0.898 oz (25.4 g)
Master (outer) case width	7.75" (196.8 mm)
Master (outer) case length	12.2" (311.1 mm)
Master (outer) case height	2.4" (61 mm)
Harmonized System (HS) code	84733020
Master (outer) case weight	27.5 oz (780.5 g)
Quantity per master (outer) case	25 pc(s)